| ハイライト: | 6μm Diamond Slurry Polishing,SiC Diamond Slurry Polishing,6μm diamond lapping slurry |
||
|---|---|---|---|
Characteristics:
★ Fine polycrystalline diamond materials.
★ Superhigh cutting force and surface finish in the processing of high hardness wafers.
★ Different carriers are suitable for different fields.
Available Sizes:
|
Size(μm)
|
0.25
|
0.5
|
1
|
3
|
4
|
6
|
|
Media
|
Water/Oil
|
Water/Oil
|
Water/Oil
|
Water/Oil
|
Water/Oil
|
Water/Oil
|
Remarks: Special sizes can be tailor-made.
Applications:
1.Semiconductor wafer processing: such as sapphire substrate, SiC wafer and sapphire window film.
2.Ceramic processing: such as Zirconia fingerprint identification chip, Zirconia ceramic mobile phone back cover and other functional ceramics.
3. Metal processing: such as stainless steel, die steel, aluminum alloy and other metal materials.
コンタクトパーソン: Zhao
Abrasive Material Polishing Powder Nano Diamond 30nm Grit For Precise Surface Polishing
Hypodermic Needle Cutting Wheel Abrasive Ultra Thin Cut Off Wheel Cutting Disc Cutting Wheel
110X90X55X20線路の粉砕車輪の柵の粉砕車輪、軌道/トラック/柵/トラック/柵/弾道のための粉砕の石
