 |
| 起源の場所: | CN |
| ブランド名: | SIGNI |
| 証明: | ISO |
| モデル番号: | ss |
| 最小注文数量: | 1pc |
|---|---|
| パッケージの詳細: | 木の場合 |
| 受渡し時間: | 15日 |
| 支払条件: | D/A、D/P、T/T、ウェスタン・ユニオン、MoneyGram |
| 素材: | ダイヤモンド | 適用: | サファイア |
|---|---|---|---|
| OEM: | はい | サイズ: | 必須によって |
| ハイライト: | SiC Diamond Grinding Wheel,SAPPHIRE ISO Diamond Grinding Wheel,SiC cbn grinding wheel |
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Silicon Back Grinding Wheels Sapphire Epitaxial Wafer For Simiconductor Field
The grinding wheels for LED substrate are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.
This kind of grinding wheel developed in out company can replace foreign products. They can be used steadily on the Japanese, Korean grinders with high performance.
Workpiece processed: sapphire epitaxial wafer, SiC Substrate epitaxial wafer, Si Substrate epitaxial wafer.
Material of workpiece: Synthetic sapphire, SiC, single crystal silicon.
Grinders: SHUWA, NTS, WEC, GALAXY, SPEEDFAM.
コンタクトパーソン: Zhao
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